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| 1/16 www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. hdmi switch ics 1 for input 1 output buffer (sync with oe) BU16025MUV description BU16025MUV is hdmi buffer ic for source, sink, and repeater equipment. each tmds input has internal 50ohm resistor. these resistors can be turned off by oe pin control. and BU16025MUV has selectable equalizer circuit and ddc active buffer to isolate capacitor between input and output. features 1) support 480i/p, 720p, and 1080i/p 12bi t deep color and 2.70gbps data rate 2) 5v tolerance to all ddc and hpd_sink inputs 3) integrated active ddc buffer 4) integrated ddc data line delay mode to get hold margin 5) integrated switchable 50 receiver termination 6) integrated low tmds output swing mode for high speed signal 7) high impedance outputs when disabled 8) tmds inputs and output hbm esd protection exceeds 8kv 9) support ac coupling input (tmds input common mode voltage is 3.3v) 10) selectable receiver equalization 11) integrated i 2 c identification data for hdmi/dvi distin ction (display port translator mode) 12) 48-pin vqfn package 13) rohs compatible applications digital tv, dvd player, set-top box, av receiv er, digital projector, desktop/note book pc no.11063eat06
technical note 2/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. absolute maximum ratings parameter ratings unit input voltage -0.3 +4.5 v ddc, hpd_sink input voltage -0.3 +5.5 v differential pin input voltage +2.5 +4.0 v pre, i2c_onb, selre f, oeb, eq, ddc_ti, ddcen, hdmid_en, hpdinv input voltage -0.3 +4.0 v power dissipation rating 2123(*1) mw storage temperature -55 +125 *1 rohm standard substrate when it?s used by than ta=25 , it?s reduced by 21.2mw/ operating conditions parameter symbol ratings unit min. typ. max. supply voltage v cc 3.0 3.3 3.6 v operating free-air temperature t a 0 - 70 tmds differential pins (a/b) input differential voltage range v id 150 - 1560 mvp-p input common voltage range v ic 1.5 - v cc +0.01 v current control resistor rext 1.18 1.2 1.22 k tmds output voltage range av cc 3 3.3 3.6 v termination resistor r t 45 50 55 signal rate - - - 2.70 gbps control pins (pre, i2c_onb, oeb, selref, eq, ddc_ti, ddcen, hdmiid_en, hpdinv) h level input voltage v ih 0.7 vcc - v cc v l level input voltage v il -0.3 - 0.3 vcc v ddc i/o pins (sclx, scly, sdax, sday) i 2 c data rate d r(i2c) - - 100 khz sdax, sclx h level input voltage v ih 2.1 - 5.5 v l level input voltage v il -0.3 - 0.35 v sday , scly h level input voltage v ih 2.1 - 5.5 v l level input voltage v il -0.3 - 1.5 v status pins (hpd_sink) h level input voltage v ih 2.1 - 5.5 v l level input voltage v il -0.3 - 0.8 v technical note 3/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. electrical characteristics (unless otherwise noted ta=25 , vcc=3.3v) parameter symbol limits unit conditions min. typ. max. stand by current (ddc_en= ?l?) ist - - 10 a oeb = ?vcc?, v il = ?0v?,v ih =?vcc? stand by current2 (ddc_en= ?h?) ist2 - 1.8 3.0 ma oeb = ?vcc?, v il = ?0v?,v ih =?vcc? circuit current icc - 68+32 *(1) 84+32 *(1) ma v ih = vcc,v il = vcc-0.4v, rext=1.2k , r t = 50 , avcc = 3.3v,pre=0v am/bm =2.25 gbps hdmi data pattern, m = 2,3,4, a1/b1 = 225 mhz clock power consumptions p d - - 381 mw v ih = vcc,v il = vcc-0.4v rext=1.2k , r t = 50 , avcc = 3.3v, pre=0v am/bm = 2.25gbps hdmi data pattern, m = 2,3,4, a1/b1 = 225 mhz clock tmds differential pins (a/b; y/z) h level output voltage v oh avcc-10 - avcc+10 mv avcc = 3.3v, r t = 50 ,pre = 0v l level output voltage v ol avcc-600 - avcc-400 mv swing voltage v swing 400 - 600 mv swing voltage2 (low tmds output swing mode) v swing 2 600 - 920 mvp-p pre = vcc, am/bm =225 mbps hdmi data pattern, m = 2,3,4, a1/b1 = 225 mhz clock tmds internal resistor r int 45 50 55 v in = 2.9v output leak current voff -10 0 10 a avcc = 3.3v, vcc=0v ddc input and output sdax, sclx input leak current i ih1 -10 - 10 a v i = 5.5v input leak current i ih2 -10 - 10 a v i = vcc h level output current i oht -10 - 10 a v o = 5.5v l level output current i ll -10 - 10 a v il = gnd l level output voltage v olt 0.43 - 0.57 v rl = 4.7k selref = ?l? 0.52 - 0.87 selref = ?h? l level input voltage below output voltage v olt -v il - 100 - mv selref = ?l? - 400 - selref = ?h? sday , scly input leak current i ih1 -10 - 10 a v i = 5.5v input leak current i ih2 -10 - 10 a v i = vcc h level output current i oh -10 - 10 a v o = 5.5v l level output current i ol -10 - 10 a v il = gnd l level output voltage v ol - - 0.2 v i out = 4ma status pins (hpd) h level output voltage v oh 2.4 - vcc v i oh = - 8ma l level output voltage v ol 0 - 0.4 v i ol = 8ma control pins (pre, oeb, ddcen, hpdinv) h level input current i ih -10 - 10 a v ih = vcc l level input current i il -10 - 10 a v il = gnd control pins (selref, eq, ddc_ti) h level input current i ih 50 - 150 a v ih = vcc l level input current i il -10 - 10 a v il = gnd control pins (i2c_onb, hdmiid_en) h level input current i ih -10 - 10 a v ih = vcc l level input current i il -150 - 50 a v il = gnd (*1) 32ma is the current through tmds internal resistor technical note 4/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. ac characteristic (unless otherwise noted ta=25 , vcc=3.3v) parameter symbol limits unit conditions min. typ. max. tmds output differ ential pin (y/z) differential output rise time (20%-80%) t r_tmds - 110 - ps av cc = 3.3v, r t = 50 , pre =?h? differential output rise time (20%-80%) t f_tmds - 110 - ps differential intra pair skew (fig9) t sk(d) - 35 - ps ddc i/o pin (sclx, scly, sdax, sday) propagetion delay (l to h) sclx to scly t plh1 - 30 - ns r l = 4.7k c l = 10pf ddc_ti = ?h? propagetion delay (h to l) sclx to scly t phl1 - 10 - ns propagetion delay (l to h) scly to sclx t plh2 - 40 - ns propagetion delay (h to l) scly to sclx t phl2 - 20 - ns propagetion delay (l to h) sdax to sday t plh3 - 570 - ns r l = 4.7k c l = 10pf ddc_ti = ?h? propagetion delay (h to l) sdax to sday t phl3 - 570 - ns propagetion delay (l to h) sday to sdax t plh4 - 370 - ns propagetion delay (h to l) sdayto sdax t phl4 - 370 - ns propagetion delay (l to h) sdax/sclx to sday/scly t plh5 - 30 - ns r l = 4.7k c l = 10pf ddc_ti = ?l? propagetion delay (h to l) sdax/sclx to sday/scly t phl5 - 10 - ns propagetion delay (l to h) sday/scly to sdax/sclx t plh6 - 40 - ns propagetion delay (h to l) sday/scly to sdax/sclx t phl6 - 20 - ns sdax/sclx output rise time t r1 - 80 - ns r l = 4.7k c l = 10pf sdax/sclx output rise time t f1 - 5 - ns sday/scly output rise time t r2 - 95 - ns sday/scly output rise time t f2 - 5 - ns status pins(hpd) propagation delay time (l to h) t plh(hpd) - 100 - ns c l =10pf propagation delay time (h to l) t phl(hpd) - 100 - ns c l =10pf technical note 5/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. electrical characteristic curves (reference data) unless otherwise noted ta=25 , vcc=3.3v stand-by current 1 0.00 0.02 0.04 0.06 0.08 0.10 0.8 1.3 1.8 2.3 2.8 3.3 vcc [v] ist [ma] stand-by current 2 0.00 0.50 1.00 1.50 2.00 3 3.2 3.4 3.6 vcc [v] ist [ma] circuit current 0.00 20.00 40.00 60.00 80.00 100.00 120.00 3 3.2 3.4 3.6 vcc [v] icc [ma] fig.1 stand-by current 1(ist) oeb = ?vcc?, ddc_en= ?0v? fig.2 stand-by current 2(ist2) oeb = ?vcc?, ddc_en= ?vcc? fig.3 circuit current(vcc + avcc) (icc) oeb = ?vcc?, ddc_en= ?0v? fig.4 eye diagram of BU16025MUV 2.25gbps data rate when pre = ?l?, test equipment dtg5334(tektronix), dsa80000b ( a g ilent ) fig.5 eye diagram of BU16025MUV 2.25gbps data rate when pre = ?h?, test equipment dtg5334(tektronix), dsa80000b(agilent) fig.6 eye diagram of BU16025MUV 2.7gbps data rate when pre = ?h?, test equipment dtg5334(tektronix), dsa80000b ( a g ilent ) technical note 6/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. measurement symbol and circuit diagram z o =r t tmds driver tmds receiver avcc z o =r t r t r t fig 7 tmds output driver tmds receiver tmds driver vid vcc rint rint a b rt rt avcc cl y z 0.5pf vy vz va vb vswing = vy - vz vid = va - vb va vcc-0.4 v 0.4 v 0 v -0.4 v vid(pp) vic tf 80% 20% vod(u) 0% 0v differential 100% tplh tr vod(o) vb vswing tphl vcc v fig8 test circuit and definition technical note 7/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. tsk(d) 50% vy vz voh vol fig9 definition of differential intra pair skew tpdhl 1.8v 80% 20% tpdlh vol 1.8v tpdhl 1.8v 80% 20% trtx(80% to 20%) tpdlh tftx(80% to 20%) 1.8v vol sda_sink scl_sink sda scl sda scl sda_sink scl_sink trtx(80% to 20%) ttx(80% to 20%) fig10 ddc timing definitions technical note 8/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. scl scl_sink sda sda_sink ddcen rext pre oeb v cc a4 b4 selectable equalizer r int a3 b3 a2 b2 a1 b1 y4 z4 y3 z3 y2 z2 y1 z1 hpd hpd_sink eq hpd_inv v cc r int v cc r int v cc r int selectable equalizer selectable equalizer selectable equalizer tmds driver tmds driver tmds driver tmds driver i2c_onb i2c slave for dual mode configuration hdmiid_en 0.4v 1.8v 0.4v 1.8v block diagram and pin configuration fig.11 block diagram of BU16025MUV bu16025 (48-pin qfn) 39 48 47 46 45 44 43 42 41 40 34 33 32 31 30 29 28 27 26 25 22 13 14 15 16 17 18 19 20 21 24 23 36 35 37 38 1 2 3 4 5 6 7 8 9 10 11 12 i2c_onb y4 pre oeb gnd hdmiid_en gnd a4 b4 test0 z4 ddc_ti vcc z3 gnd z2 vcc z1 y3 y2 y1 hpd_sink gnd gnd sclx sdax vcc selref gnd vcc sday scly rext eq vcc b3 gnd b2 vcc b1 a3 a2 a1 hpd gnd hpdinv gnd ddcen technical note 9/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. pin explanation pin i/o explanations name number b1, b2, b3, b4 38, 41, 44, 47 input tmds negative input a1, a2, a3, a4 39, 42, 45, 48 input tmds positive input z1, z2, z3, z4 23, 20, 17, 14 output tmds negative input y1, y2, y3, y4 22, 19, 16, 13 output tmds positive input eq 1 input equalizer gain setting(40k internal pull down) ?l? 5db ?h? 15db pre 3 input tmds low output swing mode(recommend high) low : off high : on hpdinv 4 input hpd output select switch low : non-invert high : invert and open drain output rext 6 input tmds current control pin(via 1. 2k to gnd) hpd 7 output hot plug detect output (*1) sdax 8 inout ddc data line(*2 vol = 0.5v) sclx 9 inout ddc clock line(*2 vol = 0.5v) test0 10 input open or gnd hdmiid_en 11 input hdmi id enable(40k internal pull up) (*3 ) low : 0xff(dvi) high : ascii (hdmi) oeb 25 input tmds line internal resistor and output enable switch low : on(enable) high : high-z scly 28 inout ddc clock line (*2) sday 29 inout ddc data line (*2) hpd_sink 30 input hot plug detect input(10k internal pull down) ddcen 32 input i 2 c repeater enable low : high-z high : enable i2c_onb 33 input built-in i 2 c slave enable switch(90k internal pull up) (*3 ) low : on high : off ddc_ti 34 input ddc data hold margin setting (40k internal pull down) (*4) ddc_ti = ?l? delay from sdax to sday = 570nsec, delay from sclx to scly = 20nsec delay from sday to sdax = 370nsec, delay from scly to sclx = 20nsec ddc_ti = ?h? delay from sdax to sday = 20nsec, delay from sclx to scly = 20nsec delay from sday to sdax = 20ncec, delay from scly to sclx = 20nsec selref 35 input sclx/sdax l level output voltage select ( 40k internal pull down) v cc 2 ,15, 21, 26, 40, 46 - power gnd 5, 12, 18, 24, 27, 31, 36, 37, 43 - ground (*1) hpd_off mode sets hot plug detect output to high im pedance. except hpd_off mode, hpd is always active. (*2) sdax/sclx, sday/scly have different l level input and ou tput voltage. please refer recommended operating condition in deta il (*3) hdmiid_en, i2c_onb don?t need to be enable except using internal i 2 c slave. (*4) data hold time increases when ddc_ti= ?l?. but data setup time and holdtime of start condition decrease. technical note 10/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. look up table of i2c_onb and hdmiid_en pin name pin setting output state oeb ddcen i2c_onb hdmi id_en i 2 c buffer internal i 2 c slave hpd tmds internal r normal mode (recommend) l l h h off off active on l h h h active off active on hpd_off mode l l h l off off high impedance on l h h l active off high impedance on tmds_off mode h l h h off off active off h h h h active off active off hpd_tmds_off mode h l h l off off high impedance off h h h l active off high impedance off display port translator mode (hdmi) - h l h active (hdmi) active off display port translator mode (dvi) - h l l active (dvi) 0xff active off none - l l - off off active off display port translator mode displayport translator mode are used to access internal i2c slave. i2c slave register stores value like below. the ascii code of this value is ?dp-hdmi adaptor technical note 11/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. i 2 c slave read access to register block step 1 0 i 2 c start(master) s s : start condition step 2 7 6 5 4 3 2 1 0 i 2 c device address write(master) 1 0 0 0 0 0 0 0 write step 3 9 i 2 c acknowledge(slave) a a : acknowledge step 4 7 6 5 4 3 2 1 0 i 2 c logic address(master) 0 0 0 0 0 0 0 0 step 5 9 i 2 c acknowledge(slave) a step 6 0 i 2 c stop(master) p p : stop condition step 7 0 i 2 c start(master) s step 8 7 6 5 4 3 2 1 0 i 2 c general address read(master) 1 0 0 0 0 0 0 1 read step 9 9 i 2 c acknowledge(slave) a step 10 7 6 5 4 3 2 1 0 i 2 c read data(slave) data data data data data data data data step 11 9 i 2 c not-acknowledge(master) x x : a (acknowledge) or ~a (not-acknowledge) when x =a, address pointer is incremented and repeat step10. when x =~ a, i 2 c slave reg stops and moves to step12. step 12 0 i 2 c stop(master) p technical note 12/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. i/o equivalence circuit 50 ax bx 50 v dd tmds input stage y z tmds output stage control input stage i 2 c input/output stage control input stage scl sda v dd v dd selref eq ddc_ti v dd control input stage i2c_onb hdmiid_en v dd v dd scl_sink sda_sink hpd_sink v dd pre oeb ddcen hpdinv hpd v dd hpd output stage hpd_sink input stage technical note 13/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. notes for use 1) internal resistor about hpd_sink for the reason hpd_sink pin have internal resistor of 10kohm like below, don?t put external resistor. 10k vcc hpd_sink BU16025MUV fig12 hpd_sink i/o schematic 2) about unused input pin a. unused inputs of tmds recommend to open tmds receiver tmds driver vcc r i nt r in t y z r t r t a vcc a b fig 13 tmds input recommendation b. unused inputs of ddc recommend to pull up. vcc sclx sdax 4.7k scly sday 4.7k vcc fig 14 unused ddc buffers of r side c. unused input of hpd recommends to open technical note 14/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. 3) serial connection of tmds differential line the serial connections of tmds differential line like fig15 decrease the jitter tolerant characteristic. especially when system needs 1080p (12bit) data rate, deterioration of jitte r tolerance is outstanding. this problem also depends on receiver ic characteristic. when 1080p (12bit) is requir ed , rohm doesn?t recommend cascade connect application. tmds receiver tmds driver vcc r int r int y z a b y z r t r t tmds receiver tmds driver vcc r int r int y z a b avcc fig 15 cascade connection notice 4) ddc line connections ddc buffer of sda /sclx and sday/scly have different low threshold level. connect like below recommend application of BU16025MUV master sink equipment slave sday scly sdax sclx sdax sclx sday scly BU16025MUV BU16025MUV repeater equipment sdax sclx sday scly BU16025MUV master slave sday scly sdax sclx sda_sink scl_sink sda scl BU16025MUV bu160xxkv(*) sdax sclx sday scly BU16025MUV (*)bu160xxkv bu16006/16018/16027/16024kv recommend application of BU16025MUV and bu160xxkv(*) source equipment sink equipment repeater equipment source equipment fig 16 ddc connection notice 5) ac coupling this ic can also communicate using ac coupling capacitor with tmds line. but even connecting ac coupling capacitor, ac current may flow if input common mode voltage between tw o devices is different. this ac current may damage the lower common mode voltage devices like pcie or displayport. 6) tmds output offset voltage offset voltage may appear to tmds output when there is no signal to tmds inpu t differential line. oe should be set to ?h? to avoid it. technical note 15/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. thermal derating curve rohm standard 4layer board fig.17 thermal derating curve 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 25 50 75 100 125 150 ambient temperature: ta () power dissipation : pd w) technical note 16/16 BU16025MUV www.rohm.com 2011.01 - rev. a ? 2011 rohm co., ltd. all rights reserved. ordering part number b u 1 6 0 2 5 m u v - e 2 part no. part no. package muv: vqfn48av7070 packaging and forming specification e2: embossed tape and reel ? order quantity needs to be multiple of the minimum quantity. r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law. |
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